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  1 composite transistors XP06401 (xp6401) silicon pnp epitaxial planer transistor for general amplification  features  two elements incorporated into one package.  reduction of the mounting area and assembly cost by one half.  basic part number of element  2sb0709a(2sb709a) 2 elements  absolute maximum ratings (ta=25?c) unit: mm marking symbol: 5o internal connection parameter symbol ratings unit collector to base voltage v cbo C60 v collector to emitter voltage v ceo C50 v emitter to base voltage v ebo C7 v collector current i c C100 ma peak collector current i cp C200 ma total power dissipation p t 150 mw junction temperature t j 150 ?c storage temperature t stg C55 to +150 ?c rating of element overall  electrical characteristics (ta=25?c) parameter symbol conditions min typ max unit collector to base voltage v cbo i c = C10 a, i e = 0 C60 v collector to emitter voltage v ceo i c = C2ma, i b = 0 C50 v emitter to base voltage v ebo i e = C10 a, i c = 0 C7 v collector cutoff current i cbo v cb = C20v, i e = 0 C 0.1 a i ceo v ce = C10v, i b = 0 C100 a forward current transfer ratio h fe v ce = C10v, i c = C2ma160 460 forward current transfer h fe ratio h fe (small/large) *1 v ce = C10v, i c = C2ma0.5 0 .99 collector to emitter saturation voltage v ce(sat) i c = C100ma, i b = C10maC 0.3 C 0.5 v transition frequency f t v cb = C10v, i e = 1ma, f = 200mhz 80 mhz collector output capacitance c ob v cb = C10v, i e = 0, f = 1mhz 2.7 pf 1 : emitter (tr1) 4 : collector (tr2) 2 : emitter (tr2) 5 : base (tr1) 3 : base (tr2) 6 : collector (tr1) eiaj : scC88 smini6-g1 package 5 10 2.1 0.1 1.25 0.10 1 3 2 0.2 0.05 0.12 +0.05 ?0.02 0.2 0.1 (0.425) 1.3 0.1 2.0 0.1 0 to 0.1 0.9 0.1 0.9 +0.2 ?0.1 6 5 4 (0.65) (0.65) 16 5 tr2 tr1 2 34 *1 ratio between 2 elements note ) the part number in the parenthesis shows conventional part numbe r .
2 composite transistors p t ta i c v ce i c i b i b v be i c v be v ce(sat) i c h fe i c f t i e c ob v cb 0 0 C18 C2 C4 C6 C8 C10 C12 C14 C16 C60 C50 C40 C30 C20 C10 collector to emitter voltage v ce ( v ) collector current i c ( ma ) ta=25?c i b = C300 a C250 a C200 a C150 a C100 a C50 a 0 0 C100 C200 C300 C400 C60 C50 C40 C30 C20 C10 base current i b ( a ) collector current i c ( ma ) v ce =C5v ta=25?c 0 0 C0.4 C0.8 C1.2 C1.6 C400 C350 C300 C250 C200 C150 C100 C50 base to emitter voltage v be ( v ) base current i b ( a ) v ce =C5v ta=25?c 0 0 C2.0 C1.6 C1.2 C0.8 C0.4 C240 C200 C160 C120 C80 C40 base to emitter voltage v be ( v ) collector current i c ( ma ) v ce =C5v ta=75?c C25?c 25?c C0.001 C0.003 C1 C3 C0.01 C0.03 C0.1 C0.3 C1 C3 C10 C10 C30 C100 C300 C1000 collector current i c ( ma ) collector to emitter saturation voltage v ce(sat) ( v ) i c /i b =10 ta=75?c 25?c C25?c 0 C1 C 3 600 500 400 300 200 100 C10 C 30 C100 C 300 C1000 forward current transfer ratio h fe collector current i c ( ma ) v ce = C10v ta=75?c 25?c C 25?c 0 0.1 0.3 40 80 120 160 140 100 60 20 1 3 10 30 100 transition frequency f t ( mhz ) emitter current i e ( ma ) v cb =C10v ta=25?c 0 C1 C5 C20 C2 8 7 6 5 4 3 2 1 C3 C50 C10 C30 C100 collector output capacitance c ob ( pf ) collector to base voltage v cb ( v ) f=1mhz i e =0 ta=25?c 0 50 100 150 200 250 02040 80 60 140 120 100 160 ambient temperature ta ( ?c ) total power dissipation p t ( mw ) XP06401
3 composite transistors nf i e nf i e h parameter i e h parameter v ce 0 0.01 0.03 6 5 4 3 2 1 0.1 0.3 1 3 10 noise figure nf ( db ) emitter current i e ( ma ) v cb =C5v f=1khz r g =2k ? ta=25?c 0 0.1 20 2 18 4 6 8 10 12 14 16 0.3 1 3 10 2 0.5 0.2 5 noise figure nf ( db ) emitter current i e ( ma ) v cb =C5v r g =50k ? ta=25?c f=100hz 10khz 1khz 1 0.1 2 3 5 10 20 30 50 100 200 300 0.3 1 3 10 2 0.5 0.2 5 parameter h emitter current i e ( ma ) v ce =C5v f=270hz ta=25?c h fe h oe ( s) h ie (k ? ) h re ( 10 C4 ) 1 C1 2 3 5 10 20 30 50 100 200 300 C3 C10 C30 C100 C20 C5 C2 C50 parameter h collector to emitter voltage v ce ( v ) i e =2ma f=270hz ta=25?c h fe h oe ( s) h ie (k ? ) h re ( 10 C4 ) XP06401
please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconductor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative character- istics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or gen- eral electronic equipment (such as office equipment, communications equipment, measuring in- struments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchas- ing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. 2001 mar


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